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This vacuum laminator uses vacuum to bond films without bubbles on build-up substrates with uneven surfaces, wafer bonding, COF/FPC substrates, and more.
This vacuum laminator is a device that adheres films without bubbles under vacuum to build-up substrates with uneven surfaces, wafer bonding, COF/FPC substrates, and more.
Ideal for laminating FPC reinforcement plates, cover layers, and aluminum heat dissipation plates for PDPs!
The "Vacuum Laminator" is a product consisting of a table that moves back and forth driven by a motor and a heating plate for pressurization. Its main purpose is for various laminating applications, but it has proven particularly effective for laminating FPC reinforcement plates, cover layers, and aluminum heat dissipation plates for PDPs. Additionally, it can be applied to the attachment of electromagnetic wave shielding to rigid flex circuits. 【Features】 ■ The control circuit is integrated into the control panel located at the bottom of the main unit. ■ It allows for cycle-up with Hot to Hot, contributing to cost reduction. ■ The heating plate temperature can be used between 50°C and 180°C. ■ Both the vacuum draw time and press time can be set arbitrarily from 1 to 9999 seconds. *For more details, please refer to the PDF document or feel free to contact us.
